July 23, 2026

AMD’s new X100 chip lineup puts embedded Ryzen AI ‘Strix Halo’ chips into robots – APUs for physical AI bring Zen 5 CPU, RDNA 3.5 GPU cores to compete with Intel’s Panther Lake

AMD is bringing its Strix Halo APUs into the world of physical AI. The new X100 series of processors come with similar specs as the various Ryzen AI Max models floating around in client devices, but they’re tailored for 24/7 operation, with a 10-year lifecycle in embedded applications like robotics. There are three SKUs that align with the three original Strix Halo models (not the updated versions with 40 CUs). The top-end X199 comes with 16 Zen 5 cores and 40 RDNA 3.5 CUs. The X188 steps down to 12 cores and 32 CUs, while the X168 comes with eight cores and the same 32 CUs.
July 9, 2026

AMD’s upcoming Zen 6 Medusa Point 10-core APU pops up on Geekbench — chip is faster than Ryzen AI 9 HX 370 & even Ryzen AI Max+ 395

AMD is expected to announce its next-gen mobile CPUs at CES 2027, but leaks have already started to pour in, giving us a decent idea of the performance we can expect. Codenamed "Medusa Point," the Red Team's upcoming lineup will likely be based on the Zen 6 microarchitecture, and one of the SKUs has just popped up on Geekbench. It scored much better than the previous leak, beating most of its contemporaries. The part showed up as "AMD Eng Sample 100-000001713-33_N" and was marked under "AMD Plum-MDS1," which we know is the platform associated with Medusa Point.
June 28, 2026

China’s Loongson launches homegrown 16-core server CPU built on LoongArch architecture — 40W chip with DDR4 ECC and 32 PCIe lanes targets cheap SMB file, database, and web servers

Loongson Technology has announced the Loongson 3C3000, a new 16-core server processor aimed at low-cost general-purpose server systems. Unveiled on June 26, 2026, via a public corporate release, the chip is based on Loongson’s in-house architecture and is designed for small- and medium-sized business workloads, including file, database, web, and business process servers. Loongson says the 3C3000’s general-purpose computing performance matches that of the company’s earlier 3C5000 server processor.
June 1, 2026

AMD promises 13% uplift with new EXPO ‘Ultra Low Latency’ overclocking on DDR5 DIMMs — automatic memory overclocking delivers 4% improvement over standard EXPO, says AMD

AMD is bringing a new automatic memory overclocking feature out, dubbed EXPO Ultra Low Latency (ULL). The new tool promises a 13% uplift in average performance across over 30 games compared to JEDEC standard speeds for DDR5, as well as a 4% uplift compared to standard EXPO, at least according to AMD’s internal benchmarks. The company hasn’t said when ULL will be available, but it has several memory partners lined up to support the feature. We don’t know much about how EXPO ULL works, and more specifically, where AMD is finding improvements compared to standard EXPO. Despite that, AMD shared some broad benchmarks looking at EXPO ULL performance on a Ryzen 7 9700X CPU in over 30 games.