While the whole market was looking at the appointment of Lip-Bu Tan as Intel chief executive, there was another major development at the company this week: The first 18A (1.8nm-class) wafers are running around Intel's Arizona fab. Intel's Fab 52 and Fab 62 in Arizona are high-volume production facilities, so running 18A fabs there is a major milestone for the company.

AMD's latest additions to its Zen 5 stack include the 16-core Ryzen 9 9950X3D and 12-core 9900X3D, set to launch on March 12. Just days before the retail embargo, a handful of Ryzen 9 9950X3D samples appear to have been tested in PassMark, a benchmarking utility (via x86deadandback on X).

Micron introduced its 16Gb DDR5 devices made on its new 1γ (1-gamma) fabrication process that uses EUV lithography, a first for Micron, today on March 25. The new IC not only delivers higher performance than its predecessor, but it also consumes less power and is poised to be cheaper to make.

In a flurry of tweets detailing Intel's upcoming processors, avid hardware leaker Jaykihn has shared specifications for Panther Lake and Wildcat Lake. Arriving in H2 this year, Panther Lake is the successor to Arrow Lake-H, which launched at this CES. Meanwhile, Wildcat Lake is rumored to power Intel's next-gen N-series chips, designed for lightweight laptops and mini-PCs.